KAC−12040
www.onsemi.com
4
Physical Orientation
Figure 3. Package Pin Orientation − Top X-Ray View
LVDS Bank 2
LVDS Bank 4
LVDS Bank 6
LVDS Bank 3
LVDS Bank 5
LVDS Bank 7
L
VDS Bank 0
L
VDS Bank 1
A
B
C
D
E
AA
AB
AC
AD
AE
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
1. The center of the pixel array is aligned to the physical package center.
2. The region under the sensor die is clear of pins enabling the use of a heat sink.
3. Non-symmetric mounting holes provide orientation and mounting precision.
4. Non-symmetric pins prevent incorrect placement in PCB.
5. Letter “F” indicator shows default readout direction relative to package pin 1.
Notes:
