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3.3
In case the XTAL model has not been recommended
by NXP have all the parameters been checked in
order they fulfill NXP, standard and application
requirements (load capacitance,pulling sensitivity,
equivalent resistance, frequency tolerance,
temperature range, frequency drift versus
temperature, ageing) ?
4
32 kHz crystal Oscillator
4.1
Has the need of a 32 kHz XTAL been discussed ? (
Zigbee specifications can be met without an external
XTAL)
4.2
In case the 32 kHz XTAL oscillator has been
implemented has the XTAL model been
recommended by NXP ?
4.3
In case the XTAL model has not been recommended
by NXP have all the parameters been checked in
order they fulfill NXP, standard and application
requirements (load capacitance,pulling sensitivity,
equivalent resistance, frequency tolerance,
temperature range, frequency drift versus
temperature, ageing) ?
5
Power Supply
5.1
Have all the VDD pins been connected according to
NXP recommendations?
5.2
Are the power supply regulators/battery well sized?
5.3
Has the decoupling of the supply regulators/battery
output been implemented?
5.4
Have the power supply pins of the IC been properly
decoupled (according to the Application Note and
Reference Design schematics?)
5.5
Have the recommendations for the values and
models of the components of the DCDC converter
been taken into account?
5.6
Has the exposed die pad been connected to GND?
6
PIOs
6.1
Has the compatibility of the logic levels with other
components been checked?
6.2
Does the max source/sink current fit the application?
7
ADC
7.1
Does the ADC characteristics fit the application?
