NXP Semiconductors
JN-RM-2079
QN9090 module development reference manual
JN-RM-2079
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© NXP Semiconductors N.V. 2020. All rights reserved.
Reference manual
Rev. 1.0
— 17 Jan 2020
19 of 31
Warning: Solder resist area recommended
Fig 15. Recommended PCB decal for HVQFN40 40-pin QFN
The solder mask used is shown in Fig 17. The pad stacks used are 0.25 mm by 1 mm
for the smaller pads, and four 1.6 mm square pads to apply paste to the paddle. The
solder paste mask has a thickness of 6-thou (0.152 mm). If the paste thickness needs
to deviate from that used NXP then it may be necessary to change the number of pads
that the paste is applied to. Paste thickness may be dictated by additional components
used in a design.
NOTE
– Solder resist area:
A specific connection used on NXP production line has to be handled carefully when
the layout is done (see nest figure)
Extra connection Forbidden routing
Fig 16. Extra test pin
