DR
AFT
DR
AFT
DRAFT
DR
D
RAFT
DRAFT
DRA
FT DRAF
D
RAFT DRAFT DRAFT DRAFT DRAFT D
DRAFT
D
RAFT DRA
FT DRAFT DRAFT DRAFT DRA
LPC2917_19_1
© NXP B.V. 2007. All rights reserved.
Preliminary data sheet
Rev. 1.01 — 15 November 2007
58 of 68
NXP Semiconductors
LPC2917/19
ARM9 microcontroller with CAN and LIN
13. Package outline
Fig 15. Package outline SOT486-1 (LQFP144)
UNIT
A
1
A
2
A
3
b
p
c
E
(1)
e
H
E
L
L
p
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
20.1
19.9
0.5
22.15
21.85
1.4
1.1
7
0
o
o
0.08
0.2
0.08
1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT486-1
136E23
MS-026
00-03-14
03-02-20
D
(1)
(1)
(1)
20.1
19.9
H
D
22.15
21.85
E
Z
1.4
1.1
D
0
5
10 mm
scale
b
p
e
θ
E
A
1
A
L
p
detail X
L
(A )
3
B
c
b
p
E
H
A
2
D
H
v
M
B
D
Z D
A
Z E
e
v
M
A
X
y
w
M
w
M
A
max.
1.6
LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm
SOT486-1
108
109
pin 1 index
73
72
37
1
144
36