DR
AFT
DR
AFT
DRAFT
DR
D
RAFT
DRAFT
DRA
FT DRAF
D
RAFT DRAFT DRAFT DRAFT DRAFT D
DRAFT
D
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LPC2917_19_1
© NXP B.V. 2007. All rights reserved.
Preliminary data sheet
Rev. 1.01 — 15 November 2007
53 of 68
NXP Semiconductors
LPC2917/19
ARM9 microcontroller with CAN and LIN
11. Static characteristics
Table 30.
Static characteristics
V
DD(CORE)
= V
DD(OSC_PLL)
; V
DD(IO)
= 2.7 V to 3.6 V; V
DD(A3V3)
= 3.0 V to 3.6 V; T
vj
= -40
°
C to +125
°
C; all voltages are
measured with respect to ground; positive currents flow into the IC; unless otherwise specified.
[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supplies
Core supply
V
DD(CORE)
Core supply voltage.
1.71
1.80
1.89
V
I
DDD(CORE)
Core supply current.
ARM9 and all
peripherals active at
max clock speeds.
-
1.1
2.5
mA/
MHz
All clocks off.
[2]
-
30
450
μ
A
I/O supply
V
DD(IO)
I/O digital supply voltage.
2.7
-
3.6
V
Oscillator supply
V
DD(OSC_PLL)
Oscillator and PLL supply
voltage.
1.71
1.80
1.89
V
I
DDD(OSC_PLL)
Oscillator and PLL supply
current.
start-up
1.5
-
3
mA
Normal mode
-
-
1
mA
Power-down mode
-
-
2
μ
A
Analog-to-digital converter supply
V
DD(A3V3)
3.3 V ADC supply voltage
3.0
3.3
3.6
V
I
DDA(A3V3)
3.3 V ADC analog supply
current.
Normal mode
-
-
1.9
mA
Power-down mode
-
-
4
μ
A
Input pins and I/O pins configured as input
V
I
Input voltage.
All port pins and V
DD(IO)
applied except port 0
pins 16 to 31.
see
Section 9
[7][8]
-0.5
-
+ 5.5
V
Port 0 pins 16 to 31.
[8]
V
VREFP
All port pins and V
DD(IO)
not applied.
-0.5
-
+3.6
V
All other I/O pins,
RESET_N, TRST_N,
TDI, JTAGSEL, TMS,
TCK.
-0.5
-
VDD(IO)
V
V
IH
HIGH-state input voltage.
All port pins, RESET_N,
TRST_N, TDI,
JTAGSEL, TMS, TCK.
2.0
-
-
V
V
IL
LOW-state input voltage.
All port pins, RESET_N,
TRST_N, TDI,
JTAGSEL, TMS, TCK.
-
-
0.8
V
V
hys
Hysteresis voltage.
0.4
-
-
V
I
LIH
HIGH-state input leakage
current.
-
-
1
μ
A