Copyright © 2019 NEXCOM International Co., Ltd. All Rights Reserved.
2
ICES 675 User Manual
Chapter 1: Product Introduction
Hardware Specifications
CPU/Chipset
▪
8th generation Intel
®
Core™ processors, BGA 1440
▪
Intel
®
Xeon
®
E-2176M processor, 6 Cores, 12M Cache, 2.7GHz (4.4GHz),
45W (support ECC)
▪
Intel
®
Core™ i7-8850H processor, 6 Cores, 12M Cache, 2.6GHz (4.3GHz),
45W
▪
Intel
®
Core™ i5-8400H processor, 4 cores, 8M Cache, 2.5GHz (4.2GHz),
45W
▪
Intel
®
Mobile CM246
Main Memory
▪
Dual channel DDR4 SO-DIMM memory socket with non-ECC support, up
to 32 GB 2666MHz, optional ECC support with Intel
®
Xeon
®
E-2176M
processor
Display
▪
Integrated Intel
®
Gen9 graphics graphic engine
▪
1 x VGA connector (resolution up to 1920x1080 @ 60Hz)
▪
1 x LVDS connector (resolution up to 1920x1080 @ 60Hz)
▪
DDI 1/2 port configurable to HDMI 1.4/DVI/DisplayPort 1.4 HDMI up
to 4096x2160 @ 30Hz/24bpp, DVI up to 1920x1200 @60Hz, DP up to
4096x2304 @ 60Hz
BIOS
▪
AMI (UEFI)
COM Express Connector
▪
AB
LVDS: (LVDS/eDP co-lay), VGA: (VGA/DDI port3 co-lay), 1 x GbE LAN,
6 x PCIe x1, HD Audio, 4 x SATA III, 8 x USB 2.0, LPC Bus, SMBus/I2C,
2 x COM, GPIO 8-bit
▪
CD
DDI1, DDI2, 1 x PCIe x16, 2 x PCIe x1, 4 x USB 3.0
Power Requirements
▪
+12VDC, +5Vsb
▪
Support both AT and ATX power supply mode
Dimensions
▪
125mm (W) x 95mm (L)
Environment
▪
Board level operating temperatures: 0°C to 60°C
▪
Storage temperatures: -20°C to 85°C
▪
Relative humidity:
10% to 95% (operating, non-condensing)
5% to 95% (non-operating, non-condensing)
Certifications
▪
Meet CE/FCC Class B
