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Click “align” to enter following interface:
Operation Step: Move the nozzle to any position above a PCB, stick one carbon paper on the PCB, click “Trail”,
the nozzle and needle will go down to leave each trails automatically , then click “nozzle1”, use the camera
to match the cross line to the trails center of nozzle 1 and needle, finally “save” the values.
Trash Box Position: Setting “throw components” position as you like.
2.5. First Trial and Test
2.5.1. First Dry Run
Usually we would suggest you to have a dry run (no components are loaded) before production test. After it goes
smoothly, you can start to produce few boards.
2.5.2. Production Test
Make a programming file
Test the file to pick and place components.
2.5.3. Component Inspection
2.5.3.1. Inspection Items
Check if the specification, direction, polarity of components are aligned with what they should be.
Whether the components are damaged or the pins are distorted.
Whether the component is off beyond allowance.
2.5.3.2. Inspection Method
The inspection methods vary from the equipment that you have.
Except visual inspection, all of amplifier, microscope, online or offline AOI equipment can be applied if the pitch
of IC is quite small to check.
