User’s Manual U12978EJ3V0UD
220
CHAPTER 18 RECOMMENDED SOLDERING CONDITIONS
The
µ
PD789800 Subseries should be soldered and mounted under the following recommended conditions.
For details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
Table 18-1. Surface Mounting Type Soldering Conditions
µµµµ
PD789800GB-
×××
×××
×××
×××
-8ES: 44-pin plastic LQFP (10
××××
10)
µµµµ
PD78F9801GB-8ES:
44-pin plastic LQFP (10
××××
10)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Twice or less
IR35-00-2
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200 °C or higher),
Count: Twice or less
VP15-00-2
Wave soldering
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature)
WS60-00-1
Partial heating method
Pin temperature: 300°C max. Time: 3 seconds max. (per pin row)
−
Caution
Do not use different soldering methods together (except for partial heating).