Mitsubishi QD60P8-G, User Manual

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MELSEC-Q
4 SETUP AND PROCEDURE BEFORE OPERATION
CHAPTER 4 SETUP AND PROCEDURE BEFORE OPERATION
The following describes the procedure prior to the QD60P8-G operation, the name and
setting of each part of the QD60P8-G, and wiring method.
4.1 Handling Precautions
The following are the precautions for handling the QD60P8-G.
(1) Do not drop the module casing, or do not subject it to strong impact.
(2) Do not remove the PCB of each module from its case. Doing so may cause
breakdowns.
(3) Be careful not to let foreign matters such as sawdust or wire chips get inside the
module. These may cause fires, failure and malfunction.
(4) The top surface of the module is covered with a protective film to prevent foreign
objects such as cable offcuts from entering the module when wiring. Do not
remove this film until the wiring is complete.
Before operating the system, be sure to remove the film to provide adequate heat
ventilation.
(5) Tighten the screws such as module fixing screws within the following ranges.
Screw location Tightening torque range
Module fixing screw (M3 screw)
*1
0.36 to 0.48N•m
Terminal block screw (M3 screw) 0.42 to 0.58N•m
Terminal block mounting screw (M3.5 screw) 0.66 to 0.89N•m
*1: The module can be easily fixed onto the base unit using the hook at the top of
the module.
However, it is recommended to secure the module with the module fixing
screw if the module is subject to significant vibration.
(6) To mount the module on the base unit, fully insert the module fixing latch into the
fixing hole in the base unit and press the module using the hole as a fulcrum.
Improper installation may result in a malfunction or breakdown of the module, or
may cause the module to fall off.
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