10002683-en-00
13
2.1.2
Handling
Fig. 2-3
Handling
Legend
1
Wafer thickness measuring device
2
Ingot removal
3
Wafer removal
4
Identification device
5
Operating panel
6
Wafer holding device
7
Rod and end piece holder
2.1.2.1
Handling assembly function
Handling is done automatically.
The following work steps are carried out:
■
Removing ingots or wafers
■
Dimensioning wafers
■
Sticking on code labels
■
Taking away ingots or wafers
1
2
3
4
5
6
7
Summary of Contents for BS 820
Page 1: ...10002683 en 00 Band Saw BS 820 Manual...
Page 28: ...28 10002683 en 00 BS 820 Product data 4 3 Layout Fig 4 1 Layout 6503 6356 3755 max 3782...
Page 51: ...10002683 en 00 51 7 7 Setup...
Page 60: ...60 10002683 en 00 BS 820 Setup...
Page 64: ...64 10002683 en 00 BS 820 Cutting...
Page 78: ...78 10002683 en 00 BS 820 Packing and transport...