LinkIt 2523 HDK v11 User's Guide
© 2015 - 2016 MediaTek Inc.
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8.
Appendix A: Acronyms and Abbreviations
The acronyms and abbreviations used in this user manual are listed in Table 31.
Table 31. Acronyms and abbreviations
Acronym Description
Acronym Description
ADC
Analog-to-Digital Converter
BT
Bluetooth
BLE
Bluetooth Low Energy
CLKO
Clock out
CMSIS-
DAP
Cortex® Microcontroller Software
Interface Standard Debug Access Port
CTP
Capacitive Touch Panel
eFuse
Electronic Fuses
EINT
External interrupt
GPIO
General Purpose I/O
GPS
Global Positioning System
HDK
Hardware Development Kit
I2C
Inter-Integrated Circuit
I2S
Integrated Interchip Sound
ISINK
LCM backlight current sink source
JTAG
Joint Test Action Group
MIPI
Mobile Industry Processor Interface
MSDC
Mass Storage Device Class
NC
Not connected
NTC
Negative Temperature Coefficient
OMTP
Open Mobile Terminal Platform
PCM
Pulse-code modulation
PSRAM
Pseudo Static Random Access Memory
RTC
Real Time Counter
SDMMC Secure Digital Multimedia Card
SPI
Serial Peripheral Interface Bus
SWD
Serial Wire Debug
TFT
Thin-Film Transistor
USB
Universal Serial Bus
VIO18
The power rail of digital LDO output 1.8V
VIO28
The power rail of digital LDO output 2.8V.
VSF
The power rail of digital LDO output for
the serial flash
VA28
The power rail of analog LDO output 2.8V.
VA18
The power rail of analog LDO output 1.8V. VBT
The power rail of analog LDO output for
Bluetooth.
VCAMA
The power rail of analog LDO output for
camera.
VUSB33
The power rail of digital LDO output for USB.
VMC
The power rail of digital LDO output for
eMMC.
VBAT
The main power rail for battery charging and
system operating power source.