LTC3350
44
3350fc
For more information
www.linear.com/LTC3350
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
package DescripTion
Please refer to
http://www.linear.com/designtools/packaging/
for the most recent package drawings.
5.00 ±0.10
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
OUTLINE M0-220 VARIATION WHKD
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
PIN 1
TOP MARK
(SEE NOTE 6)
37
1
2
38
BOTTOM VIEW—EXPOSED PAD
5.50 REF
5.15 ±0.10
7.00 ±0.10
0.75 ±0.05
R = 0.125
TYP
R = 0.10
TYP
0.25 ±0.05
(UH) QFN REF C 1107
0.50 BSC
0.200 REF
0.00 – 0.05
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
3.00 REF
3.15 ±0.10
0.40 ±0.10
0.70 ±0.05
0.50 BSC
5.5 REF
3.00 REF
3.15 ±0.05
4.10 ±0.05
5.50 ±0.05
5.15 ±0.05
6.10 ±0.05
7.50 ±0.05
0.25 ±0.05
PACKAGE
OUTLINE
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 NOTCH
R = 0.30 TYP OR
0.35
×
45
°
CHAMFER
UHF Package
38-Lead Plastic QFN (5mm
×
7mm)
(Reference LTC DWG # 05-08-1701 Rev C)
