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Only for training and service purposes
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3. TECHNICAL BRIEF
This section provides a detailed description of the Voice Call TX functions.
Figure 3-3-5. Voice call Uplink Scheme
B. Voice Call Uplink Mode (Receiver, Speaker, Headset)
From the audio path view point, voice call has the structure as Fig.3-3-5.
Each Voice Uplink Mode paths shown below.
Receiver Mode : MEMS-MIC(SPU0410HR5H)
Æ
ABB chip(AB3100) Input [MIC1N/1P]
Loud Speaker Mode : MEMS-MIC(SPU0410HR5H)
Æ
ABB chip(AB3100) Input [MIC1N/1P]
Headset Mode : Headset MIC
Æ
ABB chip(AB3100) Input [MIC2N/2P]
When the headset is inserted, USW_ID_ADC(Circuit Diagram net Name) detect the state and then,
drive headset mode.