Laurell Technologies
Operations Manual WS-650 Lite Series
Revision Date: 7/26/2011
All information contained in this manual is the property of Laurell Technologies Corporation® and is NOT to be edited, reproduced or
distributed without express written permission from a corporate officer.
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THE AREA BETWEEN THE STATIONARY SEAL AND THE ROTATING SEAL.
THIS CAN CAUSE MOTOR OR ELECTRONICS DAMAGE
.
See Fig. 4-1 below.
Do not fill up or overflow the process chamber or bowl – fluids must not be
permitted to flow under the substrate. If the chuck face shows signs of chemical
residue, remove and clean immediately. Cleaning the o-ring surface will improve
the seal. Examine and adjust your process to prevent such occurrences. See
section 4.1.3 Vacuum Chuck Wet Test
Figure
4-1
Do not at any time force fluids or pressuring gas in the center of the vacuum chuck.
Cleaning the vacuum path in this manner is dangerous and can cause significant
damage to your spin processor.
4.1 ERROR MESSAGES
The detection of abnormal operating conditions will cause the spin processor to shut
down while in the process of running a program.
Depending on the spin processor’s configuration these conditions are:
Inability of spin processor motor to maintain the programmed speed parameters.
Detection of vacuum loss to the wafer in systems equipped with a vacuum
sensor and exhaust or N2 or CDA loss.
If these conditions occur, the display will indicate an error message in the “Run Mode”
area of the display. The specific error codes are listed below.
CODE DESCRIPTION
USER
ACTION
Ready
Processor is ready to run
Press Start key
Running
Processor is running
Press Stop key to abort
Paused
Processor is in the paused state
Press the start key to
resume running
Done
Processor completed a program
Open lid, remove substrate
Lid
Open
Lid is open
Close lid to begin processing
Need
Insufficient vacuum to begin processing
Increase vacuum supply to
COVERED CHUCK FOR CLEANING
WAFER CHUCK
ROTATING SEAL
STATIONARY SEAL
DO NOT FLOOD IN THIS AREA
