3: Mounting Instructions and PCB Footprint
xPico® Embedded Device Server Integration Guide
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3. Mounting Instructions and PCB Footprint
The xPico
embedded device server dimensions and mounting instructions are shown in
the following drawings below. You may also directly access the CAD files through the
Lantronix website.
Note:
The mounting instructions in this section are applicable to both the xPico
and the xPico Wi-Fi embedded device servers though the xPico pictures below
are used to demonstrate installation.
For temperature environments up to +85° Celsius, it is recommended that the
mating PCB have its outer layers flooded with signal ground and a heat pad be
placed between the module and mating PCB. The recommended heat pad is
Lantronix part number XPC100A002-01-B. The ground flooding and heat pad
are only required for xPico Wi-Fi units in environments above +70°C. For
environments below +70°C the heat pad and ground flooding are not required.
To Access CAD Files
1. Go to
http://www.lantronix.com/products/cad-visio.html
.
2. Click
Download CAD files
here
to access the
Registration Form
.
Figure 3-1 White Mounting Quick Clip Dimensions