2
INSTALLATION
16
OPTIFLEX 2200 C/F
www.krohne.com
03/2019 - 4005066003 - AD NEPSI OPTIFLEX2200 R03 en
2.2.2 Maximum surface temperature of the housing for dust applications
For more data, refer to the table for devices that operate in Dust Zones 20 and 21 in the "Ambient
and flange temperature" section.
2.2.3 Process pressure
WARNING!
Ex iaD and Ex iaD tD devices
Ex iaD and Ex iaD tD devices
Ex iaD and Ex iaD tD devices
Ex iaD and Ex iaD tD devices
If the ambient and flange temperatures of the device are not more than values given in the table
for devices that operate in Dust Zones, the surface temperature of the housing (compact or
remote version) will not be more than +90
°
C / +194
°
F. In these conditions, the maximum surface
temperature of other parts (process connection etc.) can be more than the maximum housing
surface temperature, but it will not be more than the process temperature.
Equipment protection level (EPL)
Allowable process pressure
[kPa]
[psi]
Ga/Gb
80
…
110
11.6
…
16
Others
As per non-Ex device
As per non-Ex device