1
Chapter 1
Introduction
1-1 General Descriptions
Thank you for purchasing
HBFMF833W
Series, a Fanless Embedded Box PC
developed, designed and manufactured under leading technical power and
consistent dedication to fine workmanship.
The system has the following features besides other basic functions:
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Intel
®
Skylake/Kabylake U-Processor on board
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Support 2* SO-DIMM DDR4-2133, up to 32GB memory
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Support M12 connector
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Support IP69K waterproof and dustproof level
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All-aluminum body, produced by casting process
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Flexible I/O for customized and mission-critical projects
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Stainless steel bottom cover with stainless steel screws for outdoor use
without rust
1-2 Specifications
MB Model
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JNF833-7X00 / 3.5
”
SBC
Part No
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HBFMF833W-7
X
-2L-B
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HBFMF833W-7
X
-2C-B
BIOS
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AMI
CPU/Chipset
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Intel
®
Skylake/Kabylake U Processor (TDP 15W)
*
Note:
When the system runs, CPU will automatically adjust its working
clock frequency according to changing workload.
Memory
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2 * SO-DIMM slots DDR4-2133MHz up to 32GB
Storage
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1 * 2.5
”
SATA3 6Gb/s internal drive bay
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1 * Full-size mSATA/mini-PCI Express shared slot
Network
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1 * Intel GbE (
HBFMF833W-7X-2C-B
)
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2 * Intel GbE (
HBFMF833W-7X-2L-B
)
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1 * Half-size mini-PCIE slot (for 802.11 b/g/n + BT 4.0 installed in
WIFI model)
Rear Panel I/O
HBFMF833W-7X-2C-B
HBFMF833W-7X-2L-B
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2 * USB2.0
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1 * RJ45
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2 * COM
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1 * HDMI
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2 * WIFI Antenna
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1 * DC-In
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1 * USB3.0
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1 * USB2.0
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2 * RJ45
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1 * COM
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1 * HDMI
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2 * WIFI Antenna
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1 * DC-In
Front Panel I/O
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1 * Power SW
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1 * Power LED
Power Source
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FSP Adapter / DC12V-5A-60W
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AC 90~240V input
