IGEPv2 BOARD HARDWARE USER MANUAL v1.20
ISEE 2007 SL. All rights reserved, IGEP® is a registered trademark from ISEE 2007 SL. The following is
provided for informational purposes only.
DOCUMENT FROM ISEE 2007 S.L. MAN-PR-IGEP.0020-001.20.HW_RC 10/1/2010
22
3.5
ELECTRICAL SPECIFICATIONS
Specification
Min
Typ
Max
Unit
Power
Input Voltage DC
4.8
5
5.2
V
Current DC
650
750
mA
USB 2.0 OTG
High Speed Mode (HS)
480
Mb/s
Full Speed Mode (FS)
12.5
Mb/s
Low Speed Mode (LS)
1.5
Mb/s
USB 2.0 Host
High Speed Mode (HS)
480
Mb/s
RS485
Driver
Input High Voltage
2
V
Input Low Voltage
0.8
V
Maximum Data Rate
250
Kbps
Receiver
Output Voltage High
2.8
V
Output Voltage Low
0.4
V
Input Resistance
12
15
KOhms
JTAG
Realview ICE Tool
30
MHz
XDS560
30
MHz
XDS510
30
MHz
Lauterbach(tm)
30
MHz
microSD
Voltage Mode 1.8V
1.71
1.8
1.89
Voltage Mode 3.3V
3.2
3.3
Current
220
mA
Clock
48
MHz
DVI-D
Pixel Clock Frequency
25
75
MHZ
High level output voltage
3.3
V
Swing output voltage
400
600
mVp-p
Maximum resolution
67.5
75
82.5
Ohms
Audio-In
Peak-to-peak single-ended input voltage (0
dBFs)
1.5
Vpp
Total harmonic distortion (sine wave @ 1.02
kHz @ -1 dBFs)
-80
-75
dB
Total harmonic distortion (sine wave @ 1.02
kHz) 20 Hz to 20 kHz, A-weighted audio, Gain
= 0 dB
-85
-78
dB
Audio-Out
Load Impedance @100 pF
14
16
Ohms
Maximum Output Power (At 0.53 Vrms
differential output voltage and load impedance
= 16 Ohms)
17.56
mW
Peak-to-Peak output voltage
1.5
Vpp
Total Harmonic Distortion @ 0 dBFs
-80
-75
dB
