Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
August 2010
Thermal/Mechanical Design Guide
Order Number: 323107-002US
24
LGA1366 Socket
3.5
Durability
The socket must withstand 30 cycles of processor insertion and removal. The max
chain contact resistance from
must be met when mated in the 1st and 30th
cycles.
The socket Pick and Place cover must withstand 15 cycles of insertion and removal.
3.6
Markings
There are three markings on the socket:
• LGA1366: Font type is Helvetica Bold - minimum 6 point (2.125 mm).
• Manufacturer's insignia (font size at supplier's discretion).
• Lot identification code (allows traceability of manufacturing date and location).
All markings must withstand 260° C for 40 seconds (typical reflow/rework profile)
without degrading, and must be visible after the socket is mounted on the
motherboard.
LGA1366 and the manufacturer's insignia are molded or laser marked on the side wall.
3.7
Component Insertion Forces
Any actuation must meet or exceed
SEMI S8-95 Safety Guidelines for Ergonomics/
Human Factors Engineering of Semiconductor Manufacturing Equipment
, example Table
R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force
to insert the package into the socket.
3.8
Socket Size
Socket information needed for motherboard design is given in
This information should be used in conjunction with the reference motherboard keep-
out drawings provided in
to ensure compatibility with the reference thermal
mechanical components.
3.9
LGA1366 Socket NCTF Solder Joints
Intel has defined selected solder joints of the socket as non-critical to function (NCTF)
when evaluating package solder joints post environmental testing. The processor
signals at NCTF locations are typically redundant ground or non-critical reserved, so the
loss of the solder joint continuity at end of life conditions will not affect the overall
product functionality.
