LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications
Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide
August 2010
34
Order Number: 323107-002US
5.5
Electrical Requirements
LGA1366 socket electrical requirements are measured from the socket-seating plane of
the processor to the component side of the socket PCB to which it is attached. All
specifications are maximum values (unless otherwise stated) for a single socket
contact, but includes effects of adjacent contacts where indicated.
Table 5-4.
Electrical Requirements for LGA1366 Socket
Parameter
Value
Comment
Mated loop inductance, loop
<3.9 nH
The inductance calculated for two contacts,
considering one forward conductor and one
return conductor. These values must be satisfied
at the worst-case height of the socket.
Mated partial mutual inductance, L NA
The inductance on a contact due to any single
neighboring contact.
Maximum mutual capacitance, C
<1 pF
The capacitance between two contacts
Socket Average Contact Resistance
(EOL)
15.2 m
Ω
The socket average contact resistance target is
derived from average of every chain contact
resistance for each part used in testing, with a
chain contact resistance defined as the
resistance of each chain minus resistance of
shorting bars divided by number of lands in the
daisy chain.
The specification listed is at room temperature
and has to be satisfied at all time.
Socket Contact Resistance:
The resistance of
the socket contact, solderball, and interface
resistance to the interposer land.
Max Individual Contact Resistance
(EOL)
≤
100 m
Ω
The specification listed is at room temperature
and has to be satisfied at all time.
Socket Contact Resistance:
The resistance of
the socket contact, solderball, and interface
resistance to the interposer land; gaps included.
Bulk Resistance Increase
≤
3
m
Ω
The bulk resistance increase per contact from
24° C to 107° C
Dielectric Withstand Voltage
360 Volts RMS
Insulation Resistance
800 M
Ω
