Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
August 2010
Thermal/Mechanical Design Guide
Order Number: 323107-002US
10
Introduction
§
TCC
Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature
by using clock modulation and/or operating frequency and input voltage adjustment
when the die temperature is very near its operating limits.
T
CONTROL
T
control
is a static value below TCC activation used as a trigger point for fan speed
control.
TDP
Thermal Design Power: Thermal solution must be designed to dissipate this target
power level. TDP is not the maximum power that the processor can dissipate.
Thermal Monitor
A power reduction feature designed to decrease temperature after the processor has
reached its maximum operating temperature.
Thermal Profile
Line that defines case temperature specification of a processor at a given power level.
TIM
Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
T
LA
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink.
T
SA
The system ambient air temperature external to a system chassis. This temperature is
usually measured at the chassis air inlets.
U
A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U
equals 3.50 in, etc.
Table 1-2.
Terms and Descriptions (Sheet 2 of 2)
Term
Description
