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Intel
®
Pentium
®
III Processor/840 Development Kit Manual
4-1
Hardware Reference
4
This section provides reference information on the system hardware, including connector pinout
information and jumper settings.
4.1
Thermal Management
The objective of thermal management is to ensure that the temperature of each component is
maintained within specified functional limits. The functional temperature limit is the range within
which the electrical circuits can be expected to meet their specified performance requirements.
Operation outside the functional limit can degrade system performance and cause reliability
problems.
The Intel
®
Pentium
®
III
processor/840 Development Kit is shipped with two heatsink/fan thermal
solutions pre-installed on the primary and secondary processors using metallic clips. These thermal
solutions have been tested in an open air environment at room temperature and are sufficient for
evaluation purposes. The designer must ensure that adequate thermal management is provided for
any customer-derived designs.
4.2
In-Target Probe (ITP) Debugger Port
The evaluation platform is populated with a 1.5-V In-Target Probe (ITP) debugger port. The ITP
port provides a path for debugger tools like emulators, in-target probes, and logic analyzers to gain
access to the processor’s registers and signals without affecting high speed operation. This allows
the system to operate at full speed with the debugger attached.
Caution:
The ITP connector used on this board requires a 1.5-V supply voltage.
4.3
Post Code Display
The evaluation board has an on-board Post Code Display. Data from any code that does an I/O
write to 80H is latched on the two LED displays (U10C1 upper nibble/U11C1 lower nibble).
During BIOS startup, code is posted to these LEDs to indicate what the BIOS is doing. Application
code can post its own data to these LEDs by performing an I/O write to address 80H. The Altera
EPM7064S PLD code used to implement this function is included in Appendix C, “PLD Code
Listing.”
4.4
WTX Power Supply
WTX is a new form factor developed for the mid-range workstation market. The WTX
specification goes beyond standard form factor specifications to specify the size and shape of the
board and the interface between the board and chassis.
For more information on the WTX form factor, go to www.WTX.org.
Summary of Contents for Pentium III Processor/840
Page 1: ...Intel Pentium III Processor 840 Development Kit Manual April 2001 Order Number 273333 003...
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Page 92: ......
Page 95: ......
Page 97: ...Place inside the center of the socket Place around to socket Place one 820u close to VRM...
Page 98: ...Place one 820u close to VRM Place around the socket Place inside the center of the socket...
Page 100: ...2 3 0 1 2 No jumper Jumper position CPU VID 4 0 1 VRM VID 4 0...
Page 101: ......
Page 102: ......
Page 103: ...FSB ECC CONTROL IN ECC ENABLED...
Page 105: ......
Page 108: ...close Place to RIMM...
Page 109: ...to RIMM close Place...
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Page 118: ...Place close to P1 Place close to P0...
Page 119: ...WAKE ON LAN HEADER WTX CHASSIS EXHAUST HEADDERS WTX IO HEADDERS P1 FAN HEADER P0 FAN HEADER...
Page 121: ......
Page 123: ...MCH HUBREF GENERATION Place close to ICH ICH DECOUPLING RTC BATTERY...
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Page 132: ...Place close to P64H Rpack Decouple P64H HUBREF GENERATION...
Page 133: ...2 3 1 2 82559 EN DIS ENABLE DISABLE...
Page 135: ......
Page 136: ...to ICH close Place to ICH Place close...
Page 137: ...TBL jumper Remove in FAB B OUT IN UNLOCKED LOCKED...
Page 138: ...Place close to the power pins...
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Page 140: ...Place RC networks close to the connector...
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