Package Mechanical Specifications
38
Datasheet
3.5
Package Insertion Specifications
The processor can be inserted into and removed from a LGA775 socket 15 times. The
socket should meet the LGA775 requirements detailed in the LGA775 Socket
Mechanical Design Guide.
3.6
Processor Mass Specification
The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all
the components that are included in the package.
3.7
Processor Materials
lists some of the package components and associated materials.
3.8
Processor Markings
shows the topside markings on the processor. This diagram is to aid in the
identification of the processor.
Table 21.
Processor Materials
Component
Material
Integrated Heat Spreader
(IHS)
Nickel Plated Copper
Substrate
Fiber Reinforced Resin
Substrate Lands
Gold Plated Copper
Figure 9.
Processor Top-Side Markings Example
ATPO
S/N
INTEL ©'06 E5200
Intel® Pentium® Dual-Core
SLAY7 [COO]
2.50GHZ/2M/800/06
[FPO]
M
e
4
Summary of Contents for BX80571E5300 - Pentium 2.6 GHz Processor
Page 12: ...Introduction 12 Datasheet...
Page 32: ...Electrical Specifications 32 Datasheet...
Page 34: ...Package Mechanical Specifications 34 Datasheet Figure 6 Processor Package Drawing Sheet 1 of 3...
Page 35: ...Datasheet 35 Package Mechanical Specifications Figure 7 Processor Package Drawing Sheet 2 of 3...
Page 36: ...Package Mechanical Specifications 36 Datasheet Figure 8 Processor Package Drawing Sheet 3 of 3...
Page 40: ...Package Mechanical Specifications 40 Datasheet...
Page 74: ...Land Listing and Signal Descriptions 74 Datasheet...
Page 84: ...Thermal Specifications and Design Considerations 84 Datasheet...