Datasheet
25
Electrical Specifications
NOTES:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
All outputs are open drain.
3.
V
IL
is defined as the voltage range at a receiving agent that will be interpreted as a logical
low value.
4.
V
IH
is defined as the voltage range at a receiving agent that will be interpreted as a logical
high value.
5.
V
IH
and V
OH
may experience excursions above V
TT
.
6.
The V
TT
referred to in these specifications refers to instantaneous V
TT
.
7.
I
OL
is measured at 0.10 * V
TT.
I
OH
is measured at 0.90 * V
TT.
8.
Leakage to V
SS
with land held at V
TT
.
9.
Leakage to V
TT
with land held at 300 mV.
2.7.3.1
Platform Environment Control Interface (PECI) DC Specifications
PECI is an Intel proprietary one-wire interface that provides a communication channel
between Intel processors, chipsets, and external thermal monitoring devices. The
processor contains Digital Thermal Sensors (DTS) distributed throughout die. These
sensors are implemented as analog-to-digital converters calibrated at the factory for
reasonable accuracy to provide a digital representation of relative processor
temperature. PECI provides an interface to relay the highest DTS temperature within a
die to external management devices for thermal/fan speed control. More detailed
information may be found in the Platform Environment Control Interface (PECI)
Specification.
Table 12.
CMOS Signal Group DC Specifications
Symb
ol
Parameter
Min
Max
Unit
Notes
1
V
IL
Input Low Voltage
-0.10
V
TT
* 0.30
V
3, 6
V
IH
Input High Voltage
V
TT
* 0.70
V
TT
+ 0.10
V
4, 5, 6
V
OL
Output Low Voltage
-0.10
V
TT
* 0.10
V
6
V
OH
Output High Voltage
0.90 * V
TT
V
TT
+ 0.10
V
2, 5, 6
I
OL
Output Low Current
V
TT
* 0.10 / 67
V
TT
* 0.10 / 27
A
6, 7
I
OH
Output Low Current
V
TT
* 0.10 / 67
V
TT
* 0.10 / 27
A
6, 7
I
LI
Input Leakage Current
N/A
± 100
µA
8
I
LO
Output Leakage Current
N/A
± 100
µA
9
Summary of Contents for BX80571E5300 - Pentium 2.6 GHz Processor
Page 12: ...Introduction 12 Datasheet...
Page 32: ...Electrical Specifications 32 Datasheet...
Page 34: ...Package Mechanical Specifications 34 Datasheet Figure 6 Processor Package Drawing Sheet 1 of 3...
Page 35: ...Datasheet 35 Package Mechanical Specifications Figure 7 Processor Package Drawing Sheet 2 of 3...
Page 36: ...Package Mechanical Specifications 36 Datasheet Figure 8 Processor Package Drawing Sheet 3 of 3...
Page 40: ...Package Mechanical Specifications 40 Datasheet...
Page 74: ...Land Listing and Signal Descriptions 74 Datasheet...
Page 84: ...Thermal Specifications and Design Considerations 84 Datasheet...