Datasheet
27
Electrical Specifications
NOTES:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
GTLREF is to be generated from V
TT
by a voltage divider of 1% resistors. If an Adjustable
GTLREF circuit is used on the board (for Quad-Core processors compatibility) the two
GTLREF lands connected to the Adjustable GTLREF circuit require the following:
GTLREF_PU = 50
Ω
, GTLREF_PD = 100
Ω.
3.
R
TT
is the on-die termination resistance measured at V
TT
/3 of the GTL+ output driver.
4.
COMP resistance must be provided on the system board with 1% resistors. COMP[3:0] and
COMP8 resistors are to V
SS
.
2.8
Clock Specifications
2.8.1
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking
BCLK[1:0] directly controls the FSB interface speed as well as the core frequency of the
processor. As in previous generation processors, the processor’s core frequency is a
multiple of the BCLK[1:0] frequency. The processor bus ratio multiplier will be set at its
default ratio during manufacturing. The processor supports Half Ratios between 7.5
and 13.5, refer to
for the processor supported ratios.
The processor uses a differential clocking implementation. For more information on the
processor clocking, contact your Intel field representative.
Table 14.
GTL+ Bus Voltage Definitions
Symbol
Parameter
Min
Typ
Max
Units
Notes
1
GTLREF_PU
GTLREF_PD
GTLREF pull up on Intel
®
3 Series Chipset family
boards
57.6 * 0.99
57.6
57.6 * 1.01
Ω
2
GTLREF pull down on
Intel
®
3 Series Chipset
family boards
100 * 0.99
100
100 * 1.01
Ω
2
R
TT
Termination Resistance
45
50
55
Ω
3
COMP[3:0]
COMP Resistance
49.40
49.90
50.40
Ω
4
COMP8
COMP Resistance
24.65
24.90
25.15
Ω
4
Summary of Contents for BX80571E5300 - Pentium 2.6 GHz Processor
Page 12: ...Introduction 12 Datasheet...
Page 32: ...Electrical Specifications 32 Datasheet...
Page 34: ...Package Mechanical Specifications 34 Datasheet Figure 6 Processor Package Drawing Sheet 1 of 3...
Page 35: ...Datasheet 35 Package Mechanical Specifications Figure 7 Processor Package Drawing Sheet 2 of 3...
Page 36: ...Package Mechanical Specifications 36 Datasheet Figure 8 Processor Package Drawing Sheet 3 of 3...
Page 40: ...Package Mechanical Specifications 40 Datasheet...
Page 74: ...Land Listing and Signal Descriptions 74 Datasheet...
Page 84: ...Thermal Specifications and Design Considerations 84 Datasheet...