N 2010-03
r 2009
Application Note AN 2010-08
V2.0, August 2010
1 Introduction
The operation of high power modules results in power losses, which have to be dissipated
via a heat sink so that the maximum permissible temperature specified in the data sheet will
not be exceeded. Therefore, the mounting process of power modules is vital, because it
affects the module’s thermal performance and furthermore its reliability, which is critical for
automotive applications.
This application note gives mounting instructions for HybridPACK
TM
2 module with
recommendations how to screw the module, assemble the PCB and mount the module onto
the heat sink.
Please also note that ground straps should be worn while working with the components and
valid ESD safety instructions should be followed at all time, since IGBT modules are
electronic-static sensitive components. In addition, maximum permissible values in the
product datasheet and application notes are absolute limits which generally, even for short
times, may not be exceeded as this may lead to destruction of the component. Moreover, this
application note cannot cover every type of application and condition. Hence, the application
note cannot replace a detailed evaluation and examination by you or your technical divisions
of the suitability for the targeted applications. The application note will, therefore, under no
circumstances become part of any supplier agreed warranty, unless the supply agreement
determines otherwise in writing.
2
Proposal for Designing a Driver Board
Based on the HybridPACK™ 2 dimensions a proposal for designing a driver board can be
offered (see Figure 1). The end-hole diameter for the module solder pin connection should
be
0
,
0
25
,
0
35
,
1
−
+
mm should be taken
.
PLEASE NOTE: The drawing below offers a proposal for solder pin connection based driver
board and therefore it is not binding. Detailed evaluation and examination by you or your
technical divisions must be done in order to verify the suitability of this proposal.
When designing a driver board which uses connectors (E.g. JST connector type "09HVD6B-
EMGF-NR") the geometry and the footprints of the connector must be taken in to account.
