N 2010-03
r 2009
Application Note AN 2010-08
V2.0, August 2010
Figure 6
“X”- section Detail drawing of the HybridPACK
TM
2 bottom side. The
sealing surface corresponds to the O-ring holding groove.
The suggested dimension of the tray holding the pin fin array is depicted in Figure 7a with
specified tolerances.
The contact surfaces between the base plate of the module and the surface of the heat sink
have to be free of degradation and contamination and should be cleaned with a fresh, lint
free cloth.
PLEASE NOTE: No thermal grease is needed for mounting the HybridPACK
TM
2 on the
cooler.
The contact surface of the heat sink should not exceed the following values referenced to a
length of L=100mm:
Surface flatness
≤
50µm
Surface roughness Rz
≤
10µm
Surface roughness at the sealing surface Ra
≤
1.6µm
The heat sink has to be of sufficient stiffness for the assembly and the subsequent transport
in order not to exert additional straining or pulling forces to the base plate of the module.
During the entire assembly process the heat sink has to be handled twist free.
An example of fluid cooling system design could be referred to datasheet of HybridPACK
TM
2
and Figure 7. This cooling system is designed for O-ring sealing from Trelleborg with part
number
DRYD001590E768U
.