N 2010-03
r 2009
Application Note AN 2010-08
V2.0, August 2010
4
Application of the Liquid Cooling System
The power loss occurring in the module has to be dissipated in order not to exceed the
maximum permissible temperature specified in the datasheet during switching (T
vj_op
= 150
°C) in operation. Therefore, the design of cooling system/heat sink is of great importance to
achieve good performance.
HybridPACK
TM
2 differs from other power modules because of pin-fin array on the base plate,
which makes liquid cooling very effective in sense of thermal performance. The base plate is
made of copper (Cu) material with nickel (Ni) plating. The pin fin structure is suitable for
cooling fluids like water/ethylenglycol mixture.
PLEASE NOTE: During the mounting process damages of the nickel plating and mechanical
deformation of the pin fin structure should be strictly avoided.
As shown in the figure below the pin-fin array is on the module base plate to get maximum
heat exchange effect. An O-ring sealing type (202 x 64.2 x 3 )mm e.g. from company
Trelleborg (part number
DRYD001590E768U
) should be utilized on the heat sink in order to
confirm waterproof of the fluid cooling system. Such O-ring is held in a groove, which
surrounds the tray that holds the pin fin array, and this groove should be restricted to the
region on the heat sink that corresponds to the region around the pin fin structure see the
drawings below. With in this region there should be no contamination, scratches or other
base plate damages.
PLEASE NOTE:
IFX does not recommend the usage of a silicon gasket or other sealing
methods. The usage of sealing methods different then O-ring may cause damage on
HybridPACK™ 2 module.
Figure 5
Technical drawing of HybridPACK
TM
2 bottom side.
