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6ED family - 2nd generation 

 

Technical Description 

 

  

 

 

     Application Note 

17 

Rev. 1.3, 2014-03-23 

AN-EICEDRIVER-6EDL04-1 

recovers,  when  the  threshold  of  the  integrated  Schmitt-trigger  according  to  Figure  12  is  reached.This  means 
that the resistor to 

V

CC

 is not mandatory, but it may help to precisely adjust the fault-clear time. 

The datasheet specifies the typical fault clear time 

t

FLTCLR

 = 1.9 ms which the current source needs to charge an 

external capacitor of 1 nF without pull up resistor. This parameter can be scaled linearly to any other capacitor 
value  and  results  immediately  in  the  according  fault  clear  time.  This  means  that  e.g.  a  4.7  nF  capacitor  will 
realize a fault clear time of 4.7 * 1.9 ms = 8.9 ms. 

The design must guarantee that the voltage at capacitor C

RCin

 reaches the lower threshold of the RCin-Schmitt-

trigger for the delay time of the input noise filter at pin ITIRP. It is recommended to reach this threshold within 
500ns  and  to  use  capacitor  values  which  are  smaller  than  10nF.  Otherwise,  the  flip-flop  releases  the  gate 
sections again, so that the IGBT is turned on, which may damage the IGBT. 

3.7.3 

Deadtime & Shoot Through Prevention 

The 6ED family 

– 2

nd

 generation prevents shoot through and generates a fixed deadtime between the individual 

IGBT of each half bridge. The deadtime is typically DT = 310 ns. However, it is necessary to check the transient 
times of the driven IGBT. These times are the turn-on delay 

t

d(on)

, the rise time 

t

r

, the turn-off delay time 

t

d(off)

 and 

the  fall  time 

t

f

.  They  are  defining  the  timing  and  the  deadtime  which  is  mandatory  for  the  prevention  of  shoot 

through. A deadtime of 1 

μs to 1.5 μs is sufficient for most applications. 

3.7.4 

Undervoltage Lockout (UVLO) 

The undervoltage lockout (UVLO) of the highside sections act directly on the output gate drive flipflop according 
to  Figure  13,  so  that  an  immediate  shut  down  is  provided.  The  UVLO  is  independent  in  respect  of  all  three 
highside  gate  drive  sections.  The  levels  are 

V

CCUV+

  for  the  control  side  and 

V

BSUV+

  for  the  high  side  sections. 

Please  refer  to  the  correct  absolute  level  in  respect  to  the  individual  type  of  the  6ED  family.  Please  refer  to 
section 3.4 for further information. 

In case  of  an  UVLO  shut  down  of  an  output  section,  it  is  necessary  to reach  the  start-up  levels  of 

V

CCUV+

  and 

V

BSUV+

 again as descibed in section 3.4. The independent UVLO functions of low and high side sections enable 

a restart of the affected highside section in case of a bootstrapping supply, because the switch mode operation 
of  the  lowside  transistor  pumps  continuously  charges  into  the  according  bootstrap  capacitor,  which  increases 
the bootstrap voltage 

V

BS

 

 

 

Figure 13 

Structure of a lowside UVLO 

The UVLO for the lowside gate drive sections is common for all three output circuits and acts on a triple input 
OR-gate according to Figure 13. The output of this gate is fed into the deadtime and shoot through prevention of 
the IC. Please note here, that a lowside UVLO is also affecting the highside outputs. Hence, all the gate drives 
will be shut down in case of a lowside UVLO. 

3.8 

Calculation of power dissipation and thermal aspects 

The  6ED  family 

–  2

nd

  generation  is  available  in  two  packages,  the  PG-DSO-28  and  the  PG-TSSOP-28.  Both 

packages  are  RoHS  compliant.  Please  refer  to  section  3.9  for  further  information  in  respect  to  the  insulation 
coordination. It is essential to assure, that the component is not thermally overloaded. This can be checked by 
means  of  the  thermal  resistance  junction  to  ambient  and  the  calculation  or  measurement  of  the  dissipated 
power. The thermal resistance is given in the datasheet (section 5) and refers to a specific layout. Changes of 
this  layout  may  lead  to  an  increased  thermal  resistance,  which  will  reduce  the  total  dissipated  power  of  the 
driver  IC.  One  should  therefore  do  temperature  measurements  in  order  to  avoid  thermal  overload  under 
application relevant conditions of ambient temperature and housing. 

>1

EN

ITRIP-Latch

UVLO

DEADTIME &

SHOOT-THROUGH

PREVENTION

DEADTIME &

SHOOT-THROUGH

PREVENTION

..

.

..

.

To Highside
To Lowside

To Highside
To Lowside

Summary of Contents for EiceDRIVER 6ED Series

Page 1: ...Industrial Power Control EiceDRIVER High voltage gate drive IC Application Note AN EICEDRIVER 6EDL04 1 Rev 1 3 2014 03 23 6ED family 2nd generation Technical description ...

Page 2: ...SPECT TO ANY AND ALL INFORMATION GIVEN IN THIS APPLICATION NOTE Information For further information on technology delivery terms and conditions and prices please contact the nearest Infineon Technologies Office www infineon com Warnings Due to technical requirements components may contain dangerous substances For information on the types in question please contact the nearest Infineon Technologies...

Page 3: ...FirstGPS of Trimble Navigation Ltd EMV of EMVCo LLC Visa Holdings Inc EPCOS of Epcos AG FLEXGO of Microsoft Corporation FlexRay is licensed by FlexRay Consortium HYPERTERMINAL of Hilgraeve Incorporated IEC of Commission Electrotechnique Internationale IrDA of Infrared Data Association Corporation ISO of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION MATLAB of MathWorks Inc MAXIM of Maxim Integrate...

Page 4: ...2 Enable pin EN 10 3 3 Control output section FAULT 11 3 4 IC supply section 12 3 5 Gate drive section 13 3 5 1 Low side gate drive 13 3 5 2 High side section 13 3 5 3 Negative Transients at High Side Reference pin VSx 14 3 6 Bootstrapping 14 3 7 Protection 16 3 7 1 Overcurrent protection ITRIP 16 3 7 2 Failure reset RCin 16 3 7 3 Deadtime Shoot Through Prevention 17 3 7 4 Undervoltage Lockout UVL...

Page 5: ...ogic 11 Figure 5 Schematic of the structure of the FAULT pin 11 Figure 6 Timing diagramm for ITRIP to FAULT propagation delay 12 Figure 7 Areas of operation 12 Figure 8 Structure of the lowside gate drive section 13 Figure 9 Structure of the lowside gate drive section 14 Figure 10 Bootstrap circuit for one halfbridge a 6ED003L06 F2 and 6ED003L02 F2 b others 14 Figure 11 Size of the bootstrap capac...

Page 6: ...6ED family 2nd generation Technical Description Application Note 6 Rev 1 3 2014 03 23 AN EICEDRIVER 6EDL04 1 List of Tables Table 1 Members of 6ED family 2nd generation 7 Table 2 Used parameters 21 ...

Page 7: ...rol input HIN1 2 3 and LIN1 2 3 UVLO threshold Bootstrap diode Package Optimal for 6EDL04I06NT negative logic 12 1V 10 2V Yes DSO28 IGBT 6EDL04I06PT positive logic 12 1V 10 2V Yes DSO28 IGBT 6EDL04N06PT 6EDL04N02PR positive logic 8 9V 8 0V Yes DSO28 TSSOP28 MOSFET 6ED003L06 F2 6ED003L02 F2 negative logic 12 1V 10 2V No DSO28 TSSOP28 IGBT replacement of 1 st generation It is obvious that the 6ED fa...

Page 8: ...LOCOS process Thus there is no need for CMOS wells for preventing the latch up effect and reducing the chip size The small size of PN junctions inside the thin silicon film leads to higher switching speed lower leakage currents and consequently higher temperature stability In order to obtain a proper body contact for the thin SOI MOS transistor the channel doping is extended and connected to a com...

Page 9: ...s that the 6ED family 2 nd generation has another margin of 5 7 V with respect to COM The relevant maximum rating of 6ED family 2 nd generation in the datasheet on p 14 are The 6ED family 2 nd generation gives a maximum rating for VCC in respect to VSS 20 V The 6ED family 2 nd generation gives a maximum rating for COM in respect to VSS 5 7 V The 6ED family 2 nd generation give a maximum rating for...

Page 10: ...N 200 μA if applying a LOW signal An external additional pull up resistor can help to obtain a reliable and precise control signal B of Figure 3 presents the structure of positive logic The pull down resistor has a value of typical 5 k The input bias currents with ILIN IHIN 660 μA are therefore higher compared to the negative logic The input noise filter suppresses short pulses and prevents the dr...

Page 11: ... for this open drain pin The voltage at this pin is internally clamped to VCC as one can see in the internal structure according to Figure 5 The internal pull down FET has a typical resistance of RON FLT 61 The delay time from the triggering event to the change of status at the FAULT pin is tFLT 450 ns typically according to the timing diagram shown in Figure 6 FAULT 1 from uv detection VCC RON FL...

Page 12: ...hside supply before the IC gets into an operational state The levels of these parameters are either 11 7 V or 9 V depending on the individual type of the 6ED family It is recommended to have a margin of at least 1 V in respect to VCCUV and VBSUV in order to avoid unintended shut down caused by noise The IC shuts down the individual gate sections when the related supply voltage is below VCCUV or VB...

Page 13: ...upply voltage VCC of the IC via the reverse diodes of the FET This prevents the output pins from excessive pulse voltages which may be coupled into the gate track There is also an internal zener clamp of the push pull circuit between COM and VCC 3 5 2 High side section The high side gate drive section is shown in Figure 9 The control signal passes the high voltage level shift section and is stored...

Page 14: ...n also increase the pulse current through the external or internal bootstrap diode and may lead to damage The design target is therefore to avoid such negative transient voltage at all or to keep at least the absolute maximum ratings 3 6 Bootstrapping Bootstrapping is a common method of pumping charges from a low potential to a higher one With this technique a supply voltage for the floating highs...

Page 15: ...tor is mainly discharged by two effects The highside quiescent current and the gate charge of the transistor to be turned on The calculation of the bootstrap capacitor results in 2 with iQBS being the quiescent current of the highside section tP the switching period QG the total gate charge and vBS the voltage drop at the bootstrap capacitor within a switching period An additional margin of 20 is ...

Page 16: ...he comparator is low again This corresponds to a voltage level at the comparator of VIT TH VIT HYS 445 mV 70 mV 375 mV where VIT HYS 70 mV is the hysteresis of the ITRIP comparator RCIN IRCIN VZ 10 5V ITRIP SET DOMINANT LATCH S R Q INPUT NOISE FILTER VIT TH 0 445V Comp COM VSS VDD2 8V NMOS RON RCIN current source VSS VCC VCC to FAULT 6ED family 2nd generation RRCin CRCin VRCIN TH 5 2V VRCIN HYS 2 ...

Page 17: ...e drive sections The levels are VCCUV for the control side and VBSUV for the high side sections Please refer to the correct absolute level in respect to the individual type of the 6ED family Please refer to section 3 4 for further information In case of an UVLO shut down of an output section it is necessary to reach the start up levels of VCCUV and VBSUV again as descibed in section 3 4 The indepe...

Page 18: ...and the ext gate resistor Different cases for turn on and turn off must be considered because many designs use different resistors for turn on and turn off This leads to a specific distribution of losses in respect to the external gate resistor RGxx ext and the internal resistance of the output section 7 8 Both portions Pd2on and Pd2on together are the output section losses 3 The input sections ge...

Page 19: ...e IC Figure 14 shows these inductances and track loops VDC DBS 3 x 600V 1A VCC Low inductive shunt Small and short loops LOx HOx VSx COM VSS VBx RLim RSh CBS CDC Figure 14 Parasitic inductances in the layout First of all the gate tracks which connect the pins HOx and LOx with the according gate terminal of the power transistor and the tracks connecting the emitter source terminals of the power tra...

Page 20: ...nd the pin VS must also be small Otherwise there may be inductive voltage drops during the gate charging process of turn on which may result in spontaneous undervoltage lockout events at the high side section Finally the inductances of the DC link tracks can be partially cancelled if one places a low impedance film capacitor between the positive and negative rail closely to the transistor terminal...

Page 21: ... A area p P power b B flux density r R resistance C capacitance t T time time intervals d D duty cycle v V voltage f frequency w W energy i I current efficiency l L inductance C capacitor L inductor D diode R resistor IC integrated circuit TR transformer AC alternating current value i running variable avg average in input value DC direct current value max maximum value BE basis emitter min minimum...

Page 22: ...e KOA corporation Japan 2007 5 KOA corporation Flat chip thick film resistors general purpose RK73B Revision 10 11 2006 data sheet KOA corporation Japan 2006 6 IEC 60335 1 Household and similar electrical appliances Safety Part 1 General requirements Ed 4 2001 05 International Electrotechnical Commission Geneva Switzerland 2001 7 IEC 664 1 Insulation coordination for equipment within low voltage s...

Page 23: ...w w w i n f i n e o n c o m Published by Infineon Technologies AG AN EICEDRIVER 1 ...

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