Application Note
22 of 27
V 1.0
2021-04-30
CoolGaN™ IPS half-bridge evaluation board with IGI60F1414A1L
PCB layout
6
PCB layout
The evaluation board is 1.3 mm thick, with 4-layers 70 µm thick copper. The layer stackup is depicted below.
Figure 27
Top layer copper layer
Figure 28
Upper middle copper layer