Infineon CoolGaN IGI60F1414A1L, Manual, Page: 15 / 27

Application Note 15 of 27 V 1.0
2021-04-30
CoolGaN™ IPS half-bridge evaluation board with IGI60F1414A1L
Setup and use
Figure 17 Thermal image of the chipset in buck-mode at 100 kHz, 200 W load
4.9 Operation at high power levels
The IPS chipset without any active thermal relief can dissipate about 3 W in total without exceeding 125°C on
chipset case temperature. To increase the power dissipation capability of the chipset a heatsink can be
attached to the bottom side of the PCB in the marked area beneath the chipset (shown in
Figure 18 ). The
heatsink must be attached with an isolated thermal pad (recommending 3M 8810 double side adhesive thermal
pad). A cooling fan can be setup to cool down the heatsink. With airflow about 10 m/s this can increase the
power dissipation limit of the chipset to 6.5 W.
Figure 18 Heatsink added the back side of the PCB