Ikegami FA-55, Operation Manual

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HDK-73 1707 VER1 (E)
PRODUCTS CONFORMING TO RoHS DIRECTIVE
PRODUCTS CONFORMING TO RoHS DIRECTIVE
Following products described in this manual are products conforming to RoHS directive.
· HDK-73 Color Camera
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· BSF-55 Base Station
· OCP-300 Operation Control Panel
· MCP-300 Maintenance Control Panel
· BSH-300 Base Station Hub
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cadmium, hexavalent chromium, polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) in electrical and
electronic equipment excluding following exemption applications based on the EU directive (Directive2002/95/EC).
* About RoHS Directive
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electronic equipment.
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Applications exempted from RoHS directive compliance
Followings applications are permitted as exemptions from RoHS directive compliance.
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· halophosphate 10mg
· triphosphate with a normal lifetime 5mg
· triphosphate with a long lifetime 8mg
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6. Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminum containing up to 0.4% lead by weight and
as a copper alloy containing up to 4% lead by weight
7. Lead in following items
· Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85% lead)
· Lead in solders for servers, storage and storage array systems
· Lead in solders for network infrastructure equipment for switching, signaling, transmission as well as network management
for telecommunication
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8. Cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to
restrictions on the marketing and use of certain dangerous substances and preparations
9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators
10. Lead used in compliant pin connector systems
11. Lead as a coating material for the thermal conduction module C-ring
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13. Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors
with a lead content of more than 80% and less than 85% by weight
14. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip
Chip packages
15. Decabrominated diphenyl ether (Deca-BDE) in polymeric applications