IEI Technology WAFER-LX3, User Manual

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WAFER-LX3 3.5” Motherboard
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memory.
DIO The digital inputs and digital outputs are general control signals that
control the on/off circuit of external devices or TTL devices. Data can be
read or written to the selected address to enable the DIO functions.
EHCI The Enhanced Host Controller Interface (EHCI) specification is a
register-level interface description for USB 2.0 Host Controllers.
EIDE Enhanced IDE (EIDE) is a newer IDE interface standard that has data
transfer rates between 4.0 MBps and 16.6 MBps.
FSB The Front Side Bus (FSB) is the bi-directional communication channel
between the processor and the Northbridge chipset.
HDD Hard disk drive (HDD) is a type of magnetic, non-volatile computer
storage device that stores digitally encoded data.
L1 Cache The Level 1 Cache (L1 Cache) is a small memory cache built into the
system processor.
L2 Cache The Level 2 Cache (L2 Cache) is an external processor memory cache.
LCD Liquid crystal display (LCD) is a flat, low-power display device that
consists of two polarizing plates with a liquid crystal panel in between.
LVDS Low-voltage differential signaling (LVDS) is a dual-wire, high-speed
differential electrical signaling system commonly used to connect LCD
displays to a computer.
MAC The Media Access Control (MAC) protocol enables several terminals or
network nodes to communicate in a LAN, or other multipoint networks.
POST The Power-on Self Test (POST) is the pre-boot actions the system
performs when the system is turned-on.
RAM Random Access Memory (RAM) is volatile memory that loses data when
power is lost. RAM has very fast data transfer rates compared to other