IEI Technology WAFER-LX Series, User Manual, Page: 28 / 198

Page 28
IEI® Technology, Corp .
WAFER-LX
VESA 1.1 and 2.0 VIP/VDA support
0.13 micron process
481-terminal PBGA (Plastic Ball Grid Array) with internal heatspreader
2.3.2 AMD

Geode™ LX 800 500MHz Power Management
The power management for the 500MHz AMD

Geode™ LX 800 is listed below:
1.8W Typical (3.9W TDP) @ 500MHz
GeodeLink active hardware power management
Hardware support for standard ACPI software power management
I/O companion SUSP#/SUSPA# power controls
Lower power I/O
Wakeup on SMI/INTR
2.4 System Chipset
The WAFER-LX series motherboards all have a preinstalled AMD

Geode™ CS5536
system chipset. The system chipset features are listed below.
GeodeLink™ Interface Unit
o
64-bit, 66MHz operation
o
PCI VSM (Virtual System Module) that makes the interface transparent to
applications software and BIOS
o
Programmable routing descriptors, use and activity monitors, and SSMI
(Synchronous System Management Interrupt)
ATA-6 Controller
o
100 MB/second IDE Controller in UDMA mode per the ATA-6
specification
o
5V interface
Flash Interface
o
Multiplexed with IDE interface Connects to an array of industry standard
NAND Flash and/or NOR Flash
USB Controller
o
4 USB ports
o
Supports both USB 1.1 and USB 2.0