IEI Technology PCIE-9650, User Manual

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PCIE-9650 PICMG 1.3 CPU Card
Page 28
A cooling fan and heat sink must be installed on the CPU. Thermal paste must be
smeared on the lower side of the heat sink before it is mounted on the CPU. Heat sinks
are also mounted on the northbridge and southbridge chipsets to ensure the operating
temperature of these chips remain low.
2.9.3 Power Consumption
Table 2-1 shows the power consumption parameters for the PCIE-9650 running with a
2.66GHz Intel
®
Core
®
2 Extreme QX6700 processor with 4GB of 800MHz DDR2 memory.
Voltage Current
+3.3V 6.42
+5V 8.93A
+12V 7.42A
Table 2-1: Power Consumption
2.10 Expansion Options
2.10.1 Expansion Options Overview
A number of compatible IEI Technology Corp. PICMG 1.3 backplanes and chassis can be
used to develop and expanded system. These backplanes and chassis are listed below.
2.10.2 IEI Expansion PICMG 1.3 Backplanes
The backplanes listed in Table 2-2 are compatible with the PCIE-9650 and can be used to
develop highly integrated industrial applications. All of the backplanes listed below have
24-pin ATX connector and a 4-pin ATX connector. For more information about these
backplanes please consult the IEI catalog or contact your vendor, reseller or the IEI sales
team at sales@iei.com.tw.