COM Express® Carrier Board Design Guide
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4.2.3 Eight Layer Stack-up
Figure 38: Eight-Layer Stack-up
The figure above is an example of an eight layer stack-up. Layers L1, L3, L6 and L8 are used
for signal-routing. Layers L2 and L7 are solid ground planes, while L4 and L5 are used for
power.
Microstrip Layers 1 and 8 reference solid ground planes on Layers 2 and 7 respectively.
Inner signal Layers 3 and 6 are asymmetric striplines that route differential signals.
These signals are referenced to Layers 2 and 7 to meet the characteristic impedance
target for these traces. To reduce coupling to Layers 4 and 5, specify thicker prepreg to
increase layer separation.
Summary of Contents for ET976
Page 1: ...COM EXPRESS CARRIER BOARD DESIGN GUIDE Version 1 0 January 2022...
Page 11: ...COM Express Carrier Board Design Guide 5 Figure 3 PCI Express x4 Slot Example...
Page 12: ...6 COM Express Carrier Board Design Guide Figure 4 PCIe Mini Card Reference Circuitry...
Page 19: ...COM Express Carrier Board Design Guide 13 Figure 7 HDMI Example 1...
Page 20: ...14 COM Express Carrier Board Design Guide Figure 7 HDMI Example 2...
Page 21: ...COM Express Carrier Board Design Guide 15 Figure 8 DVI Example 1...
Page 22: ...16 COM Express Carrier Board Design Guide Figure 8 DVI Example 2...
Page 31: ...COM Express Carrier Board Design Guide 25 Figure 12 USB 3 0 Example 2...
Page 37: ...COM Express Carrier Board Design Guide 31 Figure 14 LVDS Reference Schematic 2...
Page 44: ...38 COM Express Carrier Board Design Guide Figure 16 VGA Reference Schematics 2...
Page 48: ...42 COM Express Carrier Board Design Guide Figure 18 HDA Example Schematic 2...
Page 52: ...46 COM Express Carrier Board Design Guide Figure 19 LPC Super I O Example 2...
Page 61: ...COM Express Carrier Board Design Guide 55 Figure 24 General Purpose Serial Port Example 2...
Page 70: ...64 COM Express Carrier Board Design Guide Figure 28 PWRBTN and SYS_RESET Circuitry...
Page 84: ...78 COM Express Carrier Board Design Guide Chapter 4 Carrier Board PCB Layout Guidelines...
