I-Bus IBC2602, User Manual

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Chapter 2 - Configuration and Installation
2-23
IBC2602 User's Guide
DIMM Sockets (J18/J19)
These sockets accept industry standard 168-pin DIMM memory modules.
The modules must be low profile (0.95" tall) 3.3V, PC100, or PC133
SDRAM. Maximum supported DIMM size is 256MB allowing for a
maximum of 512Mbytes.
Thermal Considerations
The IBC2602 CPU limits the operating temperature. Operating
temperature is limited by the CPU. The maximum operating temperature
is dependant on the processors maximum case temperature (Tc) and the
amount of cooling provided by the enclosure and heatsink. The IBC2602
ships from the factory with a passive heatsink for cooling the processor.
The heatsink requires forced air cooling.
The chart below shows the maximum operating temperature for the
processors currently shipping with the IBC2602. The operating
temperatures are based upon a static environment with forced air of
(100-900) LFM. Gateworks (a Division of I-Bus/Phoenix) recommends
that the user perform a complete system thermal analysis to take into
account the system's thermal properties. As different processors and
heatsinks become available, these numbers may change. Please contact
the factory for the latest configurations.
Airflow
(LFM)
Theta–SA
(
°
C/W)
Max Ambient
(
°
C), 600MHz PIII
Max Ambient
(
°
C), 500MHz PIII
100 7.3 34 38
200 3.7 67 69
300 2.5 78 79
400 2.0 82 83
500 1.7 85 86
600 1.5 87 88
700 1.3 88 89
800 1.2 89 90
900 1.1 90 91
Tjmax =100 ° C
Table 2-22: IBC2602 Operating Temperature