15
Appendices
15.1
Appendix A
A.1 Special Handling Procedures
The PCB assemblies used in the main unit, toco, FECG and ultrasound transducer
contain electrostatic sensitive devices. These may be permanently damaged by
electrostatic potentials encountered in routine handling of the assemblies during
servicing.
We therefore recommend that all servicing be carried out in a specialised handling
area (SHA) as defined by CECC00015 (published by CENELEC) to avoid damage to
the assemblies.
A.2 Recommended Soldering Equipment for Rework
The following should be used for all soldering operations carried out on any Dopplex
product in servicing:
Soldering Iron: 'Mini' type iron, temperature controlled to 375°C with fine tip
(typically 0.8mm(1/32")) earth bonded. e.g.Weller EC3100D-ESP.
Solder: SN62 type solder with multi cored flux type RA conforming to QQ-S-571e
(US federal specification). e.g. Multicore 'smart wire'.
If further information is required, please contact Huntleigh Diagnostics.
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Issue: 2 Draft
Rev: a
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