HUAWEI MU509-65 HSDPA LGA Module
Hardware Guide
Mechanical Specifications
Issue 01 (2016-04-08)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
56
6
Mechanical Specifications
6.1 About This Chapter
This chapter describes the process design and mechanical specifications:
6.2 Storage Requirement
The module must be stored and sealed properly in vacuum package under a
temperature below 40°C and the relative humidity less than 90% in order to ensure
the weldability within 12 months.
6.3 Moisture Sensitivity
The moisture sensitivity is level 3.
After unpacking, the module must be assembled within 168 hours under the
environmental conditions that the temperature is lower than 30°C and the relative
humidity is less than 60%. If the preceding conditions cannot be met, the module
needs to be baked according to the parameters specified in Table 6-1 .
Table 6-1
Baking parameters
Baking Temperature
Baking Condition
Baking Duration Remarks
125°C±5°C
Relative humidity ≤ 60%
8 hours
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