![background image](http://html.mh-extra.com/html/huawei/mu509-65/mu509-65_hardware-manual_167901057.webp)
HUAWEI MU509-65 HSDPA LGA Module
Hardware Guide
Mechanical Specifications
Issue 01 (2016-04-08)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
57
Moving, storing, and processing the product must comply with IPC/JEDEC J-STD-033.
6.4 Dimensions
Figure 6-1 shows the dimensions of the module in details.
Figure 6-1
Dimensions (Unit: mm)
Top view
Bottom view
6.5 Packaging
HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum
packing into cartons. The tray specification complies with Jedec_Tray_DGuide4-10D.