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HUAWEI MU509-65 HSDPA LGA Module
Hardware Guide
Mechanical Specifications
Issue 01 (2016-04-08)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
65
6.9 Rework
6.9.1 Process of Rework
Preparation
Component
disassembly
Soldering
area handing
Component
installation
Installation
inspection
Functional
test
Remove
obstacles
Place
the PCB
Select tools
Set temperature
Apply flux
Cool the PCB
Heat and
disassemble
Remove debris
Apply solder paste
Process the solder
pad
Check components
Heat and solder
Align components
Remove debris
Check solder points
Inspect
appearance
Check around
soldering area
Reassemble other
components
Verify the
rework
6.9.2 Preparations of Rework
Remove barrier or devices that cannot stand high temperature before rework.
If the device to be reworked is beyond the storage period, bake the device
according to Table 6-1 .
6.9.3 Removing of the Module
The solder is molten and reflowed through heating during the module removing
process. The heating rate must be quick but controllable in order to melt all the solder
joints simultaneously. Pay attention to protect the module, PCB, neighboring devices,
and their solder joints against heating or mechanical damages.
The LGA module has many solder pads and the pads are large. Therefore, common
soldering irons and heat guns cannot be used in the rework. Rework must be done using
either infrared heating rework stations or hot air rework stations. Infrared heating rework
stations are preferred, because they can heat components without touching them. In
addition, infrared heating rework stations produce less solder debris and less impact on
modules, while hot air rework stations may cause shift of other components not to be
reworked.
You must not reuse the module after disassembly from PCB during rework.
It is proposed that a special clamp is used to remove the module.
Figure 6-10
Equipment used for rework