96
HP StorageWorks XP12000 Disk Array Site Preparation Guide
delivery of 61–62
dimensions 19
electrical specifications 69–82
floor clearance 33–45
heat dissipation 49
humidity specifications 47–48
power connections 55
power consumption 49
shock specifications 49
temperature specifications 47
unpacking 63–68
vibration specifications 48
weights 19–24
disk array frame.
See
DKU
disk control frame.
See
DKC
DKC, description of 18
DKU, description of 18
documentation
conventions 7
for related products 7
revision history 9
dust control 50
E
electrical interference 59
electrical requirements 53
electromagnetic interference 59
electrostatic discharge.
See
ESD
environmental requirements 46–51
equipment servicing hazards 27
ESD 25–26, 47
F
fault-tolerant power connections 55
50-amp single-phase DKC 70
50-amp single-phase DKU 71
fire safety 27
floor
clearance 33–45
conductive 26
covering 29
cutouts 29–31, 32
grid panels 28
grounding 26, 28
load rating 28–29
tiles, and metallic particulate
contamination 51
waxed 26
floorplan 32
frequency 54
G
grid panels, floor 28
grounding 54–55, 56
H
hazards, servicing 27
heat dissipation 49
help, obtaining 8, 12, 13
HP representatives
and airborne contaminants 50
and building construction 33
and Continuous Track XP 52
and electrical requirements 53, 54
and electromagnetic interference 59
and equipment delivery 16, 62
and equipment unpacking 63
and network security 52
and power connections 74, 76, 78, 81
and power line transients 56
and site safety 27
and the site prep checklist 13
and the site prep team 11, 12
HP SR 8, 12, 13, 61, 64
humidity 46, 47–48
and ESD 25, 26
L
LAN connection 52
lightning 59