HP PAVILION Gaming 17-ak000, Maintenance And Service Manual

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Heat sink assembly
NOTE: The heat sink assembly spare part kit includes replacement thermal materials.
Description Spare part number
Heat sink for use in models with AMD Quad Core processors and discrete graphics 926904-001
Heat sink for use in models with AMD Dual Core processors and discrete graphics 926906-001
Heat sink for use in models with a fan and with AMD Quad Core processors and UMA graphics 926903-001
Heat sink for use in models with a fan and with AMD Dual Core processors and UMA graphics 926905-001
Heat sink for use in models without a fan and with AMD Dual Core processors and UMA graphics 926907-001
NOTE: To properly ventilate the computer, allow at least 7.6 cm (3.0 in) of clearance on the left side of the
computer. The computer uses an electric fan for ventilation. The fan is controlled by a temperature sensor and
is designed to turn on automatically when high temperature conditions exist. These conditions are affected by
high external temperatures, system power consumption, power management/battery conservation
configurations, battery fast charging, and software requirements. Exhaust air is displaced through the
ventilation grill located on the left side of the computer.
Before removing the heat sink assembly, follow these steps:
1. Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn the
computer on, and then shut it down through the operating system.
2. Disconnect all external devices connected to the computer.
3. Disconnect the power from the computer by first unplugging the power cord from the AC outlet and then
unplugging the AC adapter from the computer.
4. Remove the battery (see Battery on page 30 ).
5. Remove the optical drive (see Optical drive on page 31 ).
6. Remove the bottom cover (see Bottom cover on page 39 ).
To remove the heat sink assembly:
1. If you have a model with discrete graphics:
a. In the order indicated on the heat sink, loosen the seven Phillips screws (1) that secure the heat
sink to the system board.
Component replacement procedures 55