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Rev. 1.21
12
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Rev. 1.21
13
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HT66F488/HT66F489
A/D Flash MCU with EEPROM
HT66F488/HT66F489
A/D Flash MCU with EEPROM
Pin Name
Function
OPT
I/T
O/T
Description
PD�/ICPDA/
SCOM�/SSEG�
PD�
PDPU
ST
CMOS Gene�al pu�pose I/O. Registe� ena�le pull-up.
ICPDA
—
ST
CMOS ICP Data/Add�ess pin
SCOM� SLCDC�
SLCDC1
—
CMOS Softwa�e LCD COM output
SSEG� SLCDC�
SLCDC1
—
CMOS Softwa�e LCD SEG output
PD1/SCOM1/
SSEG1
PD1
PDPU
ST
CMOS Gene�al pu�pose I/O. Registe� ena�le pull-up.
SCOM1 SLCDC�
SLCDC1
—
CMOS Softwa�e LCD COM output
SSEG1 SLCDC�
SLCDC1
—
CMOS Softwa�e LCD SEG output
PD2/SCOM2/
SSEG2
PD2
PDPU
ST
CMOS Gene�al pu�pose I/O. Registe� ena�le pull-up.
SCOM2 SLCDC�
SLCDC1
—
CMOS Softwa�e LCD COM output
SSEG2 SLCDC�
SLCDC1
—
CMOS Softwa�e LCD SEG output
PD3/SCOM3/
SSEG3
PD3
PDPU
ST
CMOS Gene�al pu�pose I/O. Registe� ena�le pull-up.
SCOM3 SLCDC�
SLCDC1
—
CMOS Softwa�e LCD COM output
SSEG3 SLCDC�
SLCDC1
—
CMOS Softwa�e LCD SEG output
PD4/SCOM4/
SSEG4
PD4
PDPU
ST
CMOS Gene�al pu�pose I/O. Registe� ena�le pull-up.
SCOM4 SLCDC1
—
CMOS Softwa�e LCD COM output
SSEG4 SLCDC1
—
CMOS Softwa�e LCD SEG output
PD5/SCOM5/
SSEG5
PD5
PDPU
ST
CMOS Gene�al pu�pose I/O. Registe� ena�le pull-up.
SCOM5 SLCDC1
—
CMOS Softwa�e LCD COM output
SSEG5 SLCDC1
—
CMOS Softwa�e LCD SEG output
VDD/AVDD
VDD
—
PWR
—
Positive Powe� Supply
AVDD
—
PWR
—
Analog Positive Powe� Supply
VSS/AVSS
VSS
—
PWR
—
�egative Powe� Supply. G�ound
AVSS
—
PWR
—
Analog �egative Powe� Supply
Note: I/T: Input type;
O/T: Output type
OP: Optional by configuration option (CO) or register option
PWR: Power;
CO: Configuration option; ST: Schmitt Trigger input
CMOS: CMOS output;
AN: Analog input pin
HXT: High frequency crystal oscillator
LXT: Low frequency crystal oscillator
*: VDD is the device power supply while AVDD is the ADC power supply. The AVDD pin is bonded
together internally with VDD.
**: VSS is the device ground pin while AVSS is the ADC ground pin. The AVSS pin is bonded together
internally with VSS.
Note: 1. This Pin Description Summary table describes all resources which may not be connected to external pins.
2. For 28-SKDIP/SOP package PB0, PC1, PC2 and PC7 are not bonded to external pins and should be
properly configured to avoid a floating condition which will result in additional current leakage.