Reference Information
2-21
2-1-12 ZIC2/ZIC3 (KM416S1120D ; CMOS 16M SDRAM)
Bank Select
Data Input Register
512K x 16
512K x 16
Sense
AMP
Out
put Bu
ffer
I/O Control
Column Decoder
Latency & Burst Length
Programming Register
Ad
dress
Regis
ter
Ro
w Buf
fer
Refre
sh Coun
ter
Row De
coder
Col.
Buf
fer
LRAS
LCBR
LCKE
LRAS
LCBR
LWE
LDQM
CLK
CKE
CS
RAS
CAS
WE
L(U)DQM
LWE
LDQM
DQi
CLK
ADD
LCAS
LWCBR
Timing Register
V
DD
DQ0
DQ1
V
SSQ
DQ2
DQ3
V
DDQ
DQ4
DQ5
V
SSQ
DQ6
DQ7
V
DDQ
LDQM
WE
CAS
RAS
CS
BA
A10/AP
A0
A1
A2
A3
V
DD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
V
SS
DQ15
DQ14
V
SSQ
DQ13
DQ12
V
DDQ
DQ11
DQ10
V
SSQ
DQ9
DQ8
V
DDQ
N.C/RFU
UDQM
CLK
CKE
N.C
A9
A8
A7
A6
A5
A4
V
SS
Pin
Name
Input Function
CLK
System Clock
Active on the positive going edge to sample all inputs.
CS
Chip Select
Disables or enables device operation by masking or enabling all inputs except
CLK, CKE and L(U)DQM
CKE
Clock Enable
Masks system clock to freeze operation from the next clock cycle.
CKE should be enabled at least one cycle prior to new command.
Disable input buffers for power down in standby.
A
0
~ A
10
/AP
Address
Row / column addresses are multiplexed on the same pins.
Row address : RA
0
~ RA
10
, column address : CA
0
~ CA
7
BA
Bank Select Address
Selects bank to be activated during row address latch time.
Selects bank for read/write during column address latch time.
RAS
Row Address Strobe
Latches row addresses on the positive going edge of the CLK with RAS low.
Enables row access & precharge.
CAS
Column Address Strobe
Latches column addresses on the positive going edge of the CLK with CAS low.
Enables column access.
WE
Write Enable
Enables write operation and row precharge.
Latches data in starting from CAS, WE active.
L(U)DQM
Data Input/Output Mask
Makes data output Hi-Z, t
SHZ
after the clock and masks the output.
Blocks data input when L(U)DQM active.
DQ
0
~
15
Data Input/Output
Data inputs/outputs are multiplexed on the same pins.
V
DD
/V
SS
Power Supply/Ground
Power and ground for the input buffers and the core logic.
V
DDQ
/V
SSQ
Data Output Power/Ground
Isolated power supply and ground for the output buffers to provide improved noise
immunity.
N.C/RFU
No Connection/
Reserved for Future Use
This pin is recommended to be left No Connection on the device.
Summary of Contents for DV-P303U
Page 29: ...Reference Information 2 22 MEMO ...
Page 31: ...Product Specification 3 2 MEMO ...
Page 49: ...5 14 Disassembly and Reaasembly MEMO ...
Page 69: ...Circuit Descriptions 6 20 MEMO ...
Page 79: ...Troubleshooting 7 10 MEMO ...
Page 80: ...8 1 8 Exploded View 8 1 Cabinet Assembly 8 2 Deck Assembly Page 8 2 8 3 ...
Page 82: ...8 3 Exploded Views 8 2 Deck Assembly 107 906 ...
Page 83: ...Exploded Views 8 4 MEMO ...
Page 85: ...9 2 Replacement Parts List MEMO ...
Page 87: ...PCB Diagrams 1 11 1 Main COMPONENT SOLDER SIDE ...
Page 88: ...PCB Diagrams 2 11 2 Jack ...
Page 89: ...PCB Diagrams 3 11 3 Key 11 4 Deck ...
Page 90: ...12 1 12 Wiring Diagram ...
Page 91: ...Wiring Diagram 12 2 MEMO ...
Page 93: ...Schematic Diagrams 13 2 13 1 Power ...
Page 94: ...Schematic Diagrams 13 3 13 2 Main Micom ...
Page 95: ...Schematic Diagrams 13 4 13 3 Servo ...
Page 96: ...Schematic Diagrams 13 5 13 4 Video ...
Page 97: ...Schematic Diagrams 13 6 13 5 Audio ...
Page 98: ...Schematic Diagrams 13 7 13 6 RF ...
Page 99: ...Schematic Diagrams 13 8 13 7 ZiVA ...
Page 100: ...Schematic Diagrams 13 9 13 8 DSP ...
Page 101: ...Schematic Diagrams 13 10 13 9 Front Micom VFD Display ...
Page 102: ...Schematic Diagrams 13 11 13 10 Key ...
Page 103: ...Schematic Diagrams 13 12 13 11 Deck ...
Page 104: ...Schematic Diagrams 13 13 13 12 Remote Control ...
Page 105: ...Schematic Diagrams 13 14 MEMO ...