Harman Harman/kardon AVR 161, Service Manual

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2
3597Q–DFLASH–6/11
Atmel AT45DB321D
1. Description
The Atmel AT45DB321D is a 2.5V or 2.7V, serial interface, sequential access flash memory ideally suited for a wide variety of
digital voice-, image-, program code-, and data-storage applications. The AT45DB321D supports the Atmel RapidS serial
interface for applications requiring very high speed operations. The RapidS serial interface is SPI compatible for frequencies up
to 66MHz. The 34,603,008-bits of memory are organized as 8,192 pages of 512 bytes or 528 bytes each. In addition to the main
memory, the AT45DB321D also contains two SRAM buffers of 512/528 bytes each. These buffers allow the receiving of data
while a page in the main memory is being reprogrammed, as well as the writing of a continuous data stream. EEPROM
(electrically erasable and programmable read-only memory) emulation (bit or byte alterability) is easily handled with a self-
contained, three-step read-modify-write operation. Unlike conventional flash memories, which are accessed randomly with
multiple address lines and a parallel interface, Atmel DataFlash
®
devices use a RapidS serial interface to sequentially access its
data. The simple sequential access dramatically reduces active pin count, facilitates hardware layout, increases system
reliability, minimizes switching noise, and reduces package size. The device is optimized for use in many commercial and
industrial applications where high density, low pin count, low voltage and low power are essential.
To allow for simple, in-system reprogrammability, the AT45DB321D does not require high input voltages for programming. The
device operates from a single power supply, 2.7V to 3.6V, for both the program and read operations. The AT45DB321D is
enabled through the chip select pin (CS) and accessed via a three-wire interface consisting of the serial input (SI), serial output
(SO), and serial clock (SCK) lines.
All programming and erase cycles are self timed.
Figure 1-1. Pin configurations and pinouts.
MLF
(1)
(VDFN)
Top View
Note: 1. The metal pad on the bottom of
the MLF package is floating.
This pad can be a “No Connect” or
connected to GND.
SOIC
Top View
BGA Package Ball-out
Top View
TSOP: Type 1
Top View
Note: TSOP package is not recommended for new designs.
Future die shrinks will support 8-pin packages only.
SI
SCK
RESET
CS
SO
GND
VCC
WP
8
7
6
5
1
2
3
4
1
2
3
4
8
7
6
5
SI
SCK
RESET
CS
SO
GND
VCC
WP
NC NC NC NC
NC NC
NC
NC
NC
NC NC NC
NC
NC
NC VCC GND SCK
CS RDY/BSY WP
SI SO RESET
1 2 3 4 5
A
B
C
D
E
1
2
3
4
5
6
7
8
9
10
11
12
13
14 28
27
26
25
24
23
22
21
20
19
18
17
16
15 RDY/BUSY
RESET
WP
NC
NC
VCC
GND
NC
NC
NC
CS
SCK
SI
SO
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
Harman Kardon AVR 161 Service Manual
Page 114 of 178