17
Powering the System:
1.
Check that air/N
2
and power are properly connected.
2.
Turn the power switch to the 1 (On) position. (Fig. 20)
3.
Observe startup messages on LCD screen. Wait for READY. (Fig. 3 and Section 7.0)
4.
The system is in INSTALL/RUN or REMOVE/RUN mode, with the last-used recipe loaded in
memory. (Section 7.0)
Operation for Component Removal (Desoldering):
1.
Load the desired Recipe using the MENU buttons (Fig. 3 and Section 7.0)
2.
Select REMOVE/RUN or REMOVE/TCH mode using the MENU buttons. If REMOVE/TCH is
selected, place the tip of the TCH T/C in contact with the component solder joint. (Fig. 3, 6, and
Section 7.0)
3.
Insert the proper nozzle into the heater head (Fig. 16)
4.
Insert the standard nest plate into the nest (Fig. 19)
5.
Align the nozzle to the board using the video alignment optics. (Fig. 17, 18)
6.
Lower the head to the rough DOWN position and then adjust the nozzle height to approximately
1/8 inch above the component to be removed. The nozzle should NOT be touching the
component. (Fig. 13-15)
7.
Press <Start> to initiate the heating cycle. The system will progress through Preheat (PH), Soak
(SK) and Reflow (RF) steps at the programmed top and bottom heater settings. When in
REMOVE/RUN mode, the system will run at the programmed step heater settings for the step
times programmed in the recipe. (This is a time-driven cycle.) When in REMOVE/TCH mode,
the system will heat at the programmed step heater settings until the TGT temperature is reached
by the TCH T/C. (This is a temperature driven cycle, and is dependent on T/C feedback. Make
sure the T/C is securely in contact with the solder joint to ensure accurate temperature readings.)
An L.E.D. bar graph progressively illuminates from bottom to top, indicating progress through
the cycle (Fig. 3 and Section 7.0)
8.
At the completion of the RF heating time, the vacuum will turn on, and the system will begin to
beep. Adjust the Z height (Fig. 15) to bring the vacuum tip in contact with the top of the
component, and allow the vacuum to engage the component.
9.
Adjust the Z height back away from the board at least 1/2 inch, and then raise the head to the
rough UP position. (Fig. 15)
10.
Slide the component nest under the hot component, and lower the head near it. (Fig. 19)
11.
Press the VAC button to release the component from the tip, and initiate the Cooling (CL) timed
step, then retract the head away from the nest.
12.
The cycle is complete when the CL timer reaches the programmed value.
Note: Once the vacuum turns on at the completion of the RF recipe step, the operator has 20 seconds to
remove the component from the board and place it in the nest (Steps 8 through 11, above.) If the VAC
button is not pushed within 20 seconds, the system will go into an alarm fault mode and terminate the
run to prevent accidental board overheating.
