1-2
Temperature and humidity
Maintain the temperature and humidity in the equipment room as described in
•
High temperature can accelerate the aging of insulation materials and significantly lower the
reliability and lifespan of the device.
•
Lasting high relative humidity can cause poor insulation, electricity leakage, mechanical
property change of materials, and metal corrosion.
•
Lasting low relative humidity can cause washer contraction and ESD and bring issues
including loose screws and circuit failure.
Table1-2 Temperature and humidity requirements
Temperature
Humidity
•
Operating: 0°C to 45°C (32°F to 113°F)
•
Storage: –40°C to +70°C (–40°F to +158°F)
5% RH to 95% RH, noncondensing
Cleanliness
Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of
metal components and contact points, especially when indoor relative humidity is low. In the worst
case, electrostatic adsorption can cause communication failure.
Table1-3 Dust concentration limit in the equipment room
Substance
Concentration limit (particles/m
3
)
Dust particles
≤ 3 x 10
4
(No visible dust on the tabletop in three days)
NOTE:
Dust diameter ≥ 5 µm
The equipment room must also meet limits on salts, acids, and sulfides to eliminate corrosion and
premature aging of components, as shown in
Table1-4 Harmful gas limits in an equipment room
Gas
Maximum concentration (mg/m
3
)
SO
2
0.2
H
2
S
0.006
NH
3
0.05
NO
2
0.04
Cl
2
0.01
Cooling system
The ICG2000D, ICG2000H, and ICG 2000H-DC use passive cooling. The ICG2000D-EI uses left-
to-right airflow for heat dissipation, as shown in
For adequate cooling of the device, make sure the following requirements are met:
•
A minimum clearance of 100 mm (3.94 in) is reserved around the air inlet and outlet vents.
