Glenayre Document Number: 9110.01002
GL-T8541 PA
09/10/99
REMOVAL AND REINSTALLATION
t8541
p8.
fdk
Copyright © 1997 Glenayre
Page: 8-3
8.5 Splitter Board
8.5.1 Removal
Heed all cautions at the beginning of this section. Refer to Figure 8-4, for details.
1.
Remove the PA cover and the inner PA PCB cover.
2.
Unsolder and remove the RF input and ground straps that connect the driver board to
the splitter board.
3.
Unsolder and remove the RF output and ground straps that connect the three splitter
board outputs to the input of each of the three 120 watt PA boards.
4.
Note locations of screws and hardware for later reinstallation. Remove screws and
store for later use.
5.
The splitter board can now be lifted off of the PA module heat sink. This procedure is
complete.
8.5.2 Reinstallation
1.
Make certain that there is no grit or other foreign matter in the contact area between
power resistors R1 and R2 and the heat sink. Apply heat sink compound lightly to
chassis contact area and bottom surface of the two power resistors, if necessary.
2.
Place board so that all of the threaded holes in the PA module heat sink line up with
the screw holes in the splitter board.
3.
Reinstall screws removed during removal process. Do not tighten yet.
4.
Once all screws are installed, tighten all screws, starting with screws holding power
resistors.
5.
Resolder the copper straps that connect the Driver module RF output and ground to the
splitter board RF input and ground.
6.
Resolder the RF output and ground straps that connect the three splitter board RF
outputs to the input of each of the three 120 watt PA boards.
7.
Replace the PA cover and the inner PA PCB cover. This procedure is complete.
