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GSP665x-EVBIMS2  

High Power IMS 2 Evaluation Platform 

Technical Manual 

                                    _____________________________________________________________________________________________________________________ 

GSP665x-EVBIMS2 TM  rev. 201021 

© 2020 GaN Systems Inc.    

www.gansystems.com

                           5 

 

Please refer to the Evaluation Board/Kit Important Notice on page 22 

1

 

Overview 

 

1.1

 

Introduction 

A frequent challenge for power designers is to engineer a product that has excellent power density  and  
reduced cost of the system simultaneously. 
 
This IMS evaluation platform demonstrates an effective way to improve heat transfer, to increase power 
density and reduce system cost. An Insulated Metal Substrate PCB (IMS PCB) is used to cool 

GaN Systems’

 

bottom-side cooled power transistors. An IMS PCB is also known as Metal Core/Aluminum PCB. 
 
Examples of applications that have successfully used this approach include: 
 

 

Automotive:    

3.3kW-22kW on board charger, DC/DC, 3-

Φ

 inverter, high power wireless charger 

 

Industrial:        

3-7kW Photovoltaic Inverter and Energy Storage System (ESS), Motor Drive / VFD 

 

Server/Datacenter:  

3kW Server ACDC power supply. 

 

Consumer:        

Residential Energy Storage System (ESS) 

 
This evaluation platform consists of two parts: the IMS 2 EVB board (mother board)  and the IMS 2 half 
bridge power board, as show in Figure 1. The IMS 2 half bridge power board is available in 2 power levels: 
3kW and 6kW.  
 
A  suitable  heatsink  is  included  for  lower  power  applications.  For  higher  power  applications  additional 
heatsinking may be required. To prevent device damage, ensure adequate heatsinking through design and 
by monitoring the component temperatures during operation. 
 
To  assemble  a  heatsink,  apply thermal  grease to  the  heatsink  /  IMS  board  interface  before  screwing  the 
units together. Enough thermal grease should be applied so that a small amount extrudes on all four sizes 
as the screws are tightened.  Wipe the assembly clean. 

      

 

Figure 1 IMS 2 EVB mother board and IMS 2 half bridge power module with heatsink  

 
With these  building  blocks,  the  evaluation  platform  can  be  purchased  in 4 different  configurations:  low 
power and high power, half bridge and full bridge. Table 1 lists the ordering options. 

Summary of Contents for GSP665HPMB-EVBIMS2

Page 1: ...____________________________________ GSP665x EVBIMS2 TM rev 201021 2020 GaN Systems Inc www gansystems com 1 Please refer to the Evaluation Board Kit Important Notice on page 22 IMS 2 Evaluation Platf...

Page 2: ...IEF CONTACT DURING OPERATION MAY RESULT IN SEVERE INJURY OR DEATH Please sure that appropriate safety procedures are followed This evaluation kit is designed for engineering evaluation in a controlled...

Page 3: ...Technical Description 6 1 2 2 IMS Board thermal design 7 1 3 IMS 2 Half Bridge Board Design 9 1 4 IMS 2 EVB Mother Board 10 1 4 1 Gate Driver Circuit 11 1 4 2 5V input 11 1 4 3 Temperature monitoring...

Page 4: ...S board 7 Figure 4 Comparison of Junction to Heatsink thermal resistance RthJ HS Estimated based on GS66516B 8 Figure 5 IMS 2 half bridge power board GSP66508HB EVBIMS2 9 Figure 6 Circuit block diagra...

Page 5: ...7kW Photovoltaic Inverter and Energy Storage System ESS Motor Drive VFD Server Datacenter 3kW Server ACDC power supply Consumer Residential Energy Storage System ESS This evaluation platform consists...

Page 6: ...BIMS2 or GSP66508HB EVBIMS2 half bridge boards N A GSP66508HB EVBIMS2 Optimized IMS 2 Half Bridge based on GS66508B GaNPX bottom cooled E HEMTs GS66508B GSP66516HB EVBIMS2 Optimized IMS 2 Half Bridge...

Page 7: ...Gallium Nitride power devices are adopted widely the industry is trending away from through hole packaging TH towards surface mount packaging SMT Traditional TH devices such as the TO 220 are no longe...

Page 8: ...esign options The IMS board clearly comes out ahead Table 3 Performance comparison of 3 thermal design options for SMT power devices IMS PCB Thermal grease IMS Board Thermal resistance Good Better Bes...

Page 9: ...8HB EVBIMS2 and GSP66516B EVBIMS2 This approach addresses the shortcomings of implementing the design on a single layer IMS board While a large copper area is preferred to maximize heat spreading and...

Page 10: ...it Important Notice on page 22 1 4 IMS 2 EVB Mother Board GaN Systems offers a high power IMS 2 evaluation board that can be purchased separately The ordering part number is GSP665HPMB EVBIMS2 It can...

Page 11: ...ate driver after the LDO chip U3 the output is divided to 6 3V to power the gate driver o R1 and R2 are gate turn on and off resistors 1 4 2 5V input The gate driver circuit on the IMS 2 EVB mother bo...

Page 12: ...ces come from the external PWM connector J1 as shown in Figure 9 The deadtime of PWM signals are required and should be provided from the external source 1 4 5 Installation of IMS 2 Half Bridge Power...

Page 13: ...te Driver Vdc PHA PHB Vdc PGND L C DC Power Source RL PGND Synchronous Buck DC DC Phase Shift Full Bridge Totem Pole PFC Gate Driver DC Power Source Vdc Vdc PHA PHB Vdc PGND L C RL Gate Driver DC Powe...

Page 14: ...e refer to the Evaluation Board Kit Important Notice on page 22 2 Test Results 2 1 Double pulse test GSP665HPMB EVBIMS2 GSP66508HB EVBIMS2 Test condition VDS 400V ID 30A VGS 6V 3V L 37uH No RC Snubber...

Page 15: ...1 2020 GaN Systems Inc www gansystems com 15 Please refer to the Evaluation Board Kit Important Notice on page 22 2 2 Full power emulation test GSP665HPMB EVBIMS2 GSP66508HB EVBIMS2 Test condition VIN...

Page 16: ...___________________________________________________________ GSP665x EVBIMS2 TM rev 201021 2020 GaN Systems Inc www gansystems com 16 Please refer to the Evaluation Board Kit Important Notice on page 2...

Page 17: ...stems Inc www gansystems com 17 Please refer to the Evaluation Board Kit Important Notice on page 22 3 Appendix 3 1 IMS 2 Half Bridge Power Board IMS 2 half bridge power board schematics for GSP66508H...

Page 18: ...______________________ GSP665x EVBIMS2 TM rev 201021 2020 GaN Systems Inc www gansystems com 18 Please refer to the Evaluation Board Kit Important Notice on page 22 IMS 2 half bridge power board PCB l...

Page 19: ...________________________________________________________________________________________________ GSP665x EVBIMS2 TM rev 201021 2020 GaN Systems Inc www gansystems com 19 Please refer to the Evaluation...

Page 20: ...___________________________________________________________________________ GSP665x EVBIMS2 TM rev 201021 2020 GaN Systems Inc www gansystems com 20 Please refer to the Evaluation Board Kit Important...

Page 21: ...C27 C34 C35 CAP CER 1UF 10V X5R 0603 8 Samsung CL10A105KP8NNNC C40 C41 C42 C43 CAP CER 68PF 50V C0G NP0 0603 4 Sams CL10C680JB8NNNC D1 D3 D5 D7 DIODE ARRAY SCHOTTKY 30V SOT323 4 ON Semiconductor Fairc...

Page 22: ...es GaN Systems from all claims arising from the handling or use of the goods Due to the open construction of the product it is the user s responsibility to take any and all appropriate precautions wit...

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